• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for embedding at least one component in a printed circuit board, with the steps of providing a lower, on a first metallic support layer (2) applied metallic conductor foil (1), forming recessed alignment marks (3) in the conductor foil (1) on the registration marks (3) registered applying an adhesive layer (4) and placing a component (5) with its back on the adhesive layer (4) with upwardly facing pads (6), curing of the adhesive layer, embedding the component (5) in an insulating layer (11), applying a metallic upper conductor foil (9) and an upper metallic supporting layer (10), solidifying the structure, removing the supporting layers (2, 10), exposing the alignment marks (3) of the lower conductor foil (1) by removing the insulating layer (11), producing at the lower conductor foil (1) terminating exemptions (12), registered at the alignment marks producing bores (13) to the Connecting surfaces (6) of the component (5) and applying a conductor layer at the top of the structure, making contacts (14) in the bores (13) to the pads (6) of the component (5) and structuring the conductor layer for the production of printed conductors (15).
    公开号:AT513047A4
    申请号:T740/2012
    申请日:2012-07-02
    公开日:2014-01-15
    发明作者:Wolfgang Schrittwieser
    申请人:Austria Tech & System Tech；
    IPC主号:
    专利说明:

    P12634
    Method for embedding at least one component in a printed circuit board
    The invention relates to a method for embedding at least one component, which is fixed on a lower conductor foil by gluing and whose pads face up, in a printed circuit board.
    Likewise, the invention relates to a printed circuit board with at least one embedded component, which is adhesively attached to a lower conductor foil and the connecting surfaces of which show upward, which is produced according to a method according to the invention.
    A component, such as a chip, can in principle "face down" or "face up" embedded in a printed circuit board. In the former case, the component side having contacts is connected to a metallic conductor layer, such as a metal conductor. in the second-mentioned case, the component is reversed connected to the metallic conductor layer, i. the bonding takes place, as in a method of the subject type, on the side facing away from the contacts of the component. Processes of this kind are disclosed, for example, in WO 2007/087660 A1 and WO 2009/143550 A1 of the Applicant.
    At "face down" The embedding method often has the moisture absorption of polyimide passivation layers adversely affecting the quality of a printed circuit board module made in this way. Namely, the residual moisture remains at the lower side of the component adhered to the metallic conductor layer. Furthermore, e.g. due to inhomogeneities of the adhesive with air / gas and moisture filled cavities that remain after curing of the adhesive. Such inhomogeneities can adversely affect the reliable contacting of the components that occurs through the metallic conductor layer. The above-mentioned WO 2012/016258 A2 deals with this problem and proposes a solution based on a special adhesive and bonding method.
    Since at "face up" Embedding method that side of a component on the metallic conductor layer is glued, which generally carries no contacts, the aforementioned problems are eliminated or at least drastically reduced.
    Another problem is generally that the machining, in particular the application of adhesive surfaces and components as well as (laser) drilling for the preparation of contacts on the connections of components in view of the small dimensions of the pads only when aligning the tools used Pass or registration marks (hereinafter also commonly referred to as "marks"), so-called "fiducials", can be made which are applied to generally metallic conductor layers, in particular in the form of bores.
    In the above "face down" Embedding techniques, such alignment marks are initially used for component mounting, i. the placement machine is aligned from the top of the brands and the components are applied from above the metallic conductor layer. In the later step of laser drilling for the contacting of the component, the alignment marks are now detected from below, in order to adjust the device for laser drilling, which is drilled from below through the metallic conductor layer. In this way, with regard to the positioning of the holes very high accuracies can be achieved, which are required in view of the extremely small dimensions of the pads (contacts) of the components to be embedded.
    In contrast, in the known "face up" Embedding no direct relation between the mounting position of the circuit board and the contacting position of the components given. Usually, in this case, registration marks for components are first of all recorded from below and then through holes are produced through the entire structure from the bottom to the top. These through holes serve as additional alignment marks and are gripped from above to make the contact holes to the pads of the components in the right places. In particular, when producing the through holes, it comes through the devices used inaccuracies that affect adversely on the subsequent contacts performed. With such a method, inaccuracies in the range of ± 60pm can be expected, which limits further miniaturization.
    It is an object of the invention to increase the achievable accuracy in the manufacture of a printed circuit board with embedded components, without this leading to a high cost in terms of time and cost. It is also an object of the invention to circumvent the problems described in the "face down" embedding or embedding.
    This object is achieved by a method of the aforementioned type, which according to the invention is characterized by the following steps: a) providing a lower conductor foil which is applied to a first metallic support layer, b) forming alignment marks at least in the conductor foil, c) d) registering a component with its rear side on the adhesive layer, wherein the connection surfaces of the component point upward, and curing the adhesive of the at least one adhesive layer, e) embedding of the component in an insulating layer, PI2634 * · · »* ·
    g) compressing and solidifying the entire structure, h) removing the support layers, i) exposing the alignment marks of the lower conductor foil by removing the insulating layer in the region of the alignment marks and generating corresponding clearances, j ) Producing bores by means of laser to the contact surfaces of the component and k) applying a conductor layer at least at the top of the structure, producing contacts in the bores to the contact surfaces of the component and structuring the conductor layer for the production of printed conductors.
    Thanks to the invention, in a face-up embedding method only a one-time alignment with alignment marks is required, which, in contrast to the methods known from the prior art, can achieve considerably higher accuracies in the production of the contact bores. Due to the direct relation between placement and contacting days, much higher accuracies can be achieved than with common registration procedures. In fact, accuracies in the range of ± 20μπι arise.
    With regard to the use of an adhesive for fixing the components, it is expedient if the lower and / or upper conductor foil is provided with an insulating coating, as this covers the relatively rough surface of the conductor foils, which are usually made of copper. This will e.g. The so-called "Bleeding" effect is avoided, in which solvent escapes from the adhesive and it comes to a drying out of the adhesive.
    In view of a cost-effective and proven production, it is expedient if the conductor foils and the support layers consist of copper.
    Since laser drilling equipment is usually also available for other drilling operations during the manufacturing process, it is advantageous if the alignment marks are formed by laser drilling. It has proven particularly useful when laser drilling takes place with the aid of a UV laser.
    It is inexpensive and proven in practice that the adhesive layer is applied by screen printing.
    If, in step d), an alignment takes place on outer edges and / or connecting surfaces of the component, a particularly high accuracy is achieved in subsequent subsequent steps. PI2634 * · · · 9MM • 99 «• • 9 • * 99 9 9 t • • •» ··· «« m 9 9 • 9 ♦ * * · 9 9 99 9 * · • · 9 · • • •
    To achieve high packing densities, it is expedient if the component is designed as a thinned chip.
    In practice, it has proven to be particularly expedient and cost-effective if the insulating layer consists of a the at least one component corresponding cut-out film and an overlying, continuous cover sheet.
    For rapid and safe production and to avoid the remaining of moisture residues, it is useful if in step g) mechanical pressure, elevated temperature and negative pressure (vacuum) is applied to the structure.
    The precision required in the production of the exemptions with respect to the bore depth can be achieved particularly easily if in step i) the exemptions are produced with the aid of a picosecond laser drilling technique.
    It has proved to be advantageous if in the production of the holes in step j) in a first partial step, first with a UV laser, the upper conductor foil is removed and then in a second step by means of a CCh laser, the layer up to the pads of Components is removed.
    On the other hand, the apparatus cost can be reduced in the application of the method, if in step j) the holes are produced in a single step using a Pikosekun-the-Laserbohrtechnik.
    A printed circuit board with at least one embedded component, which is adhesively attached to a lower conductor foil and faces upwards, which is produced by a method according to the invention, is characterized by a high reliability with very high packing density.
    The invention together with further advantages is explained in more detail below by way of example embodiments, which are illustrated in the drawing. 1 to 10 show the individual method steps of the invention for constructing a printed circuit board structure having at least one component each in schematic sections of a part of a printed circuit board.
    With reference to FIGS. 1 to 10, the method according to the invention for producing a conductor plate with at least one integrated component or such a printed circuit board according to the invention will now be described.
    1 shows the first step of the method, namely the provision of a thin lower conductor foil 1, for example a 2 pm Cu foil, which is supported on a stronger lower support layer 2, for example a 70 pm Cu foil, the layers 1 and 2 are interconnected. The lower conductor foil / support layer combination may also have an insulating coating, not shown here, for example a resin layer, which may be at the top, i. is applied to the conductor foil 1, and the example, a P12634 «· · · ·
    • ft »· · · · · · · · · · ·
    Starch of 5 to 15 μιη has. By such a coating, the relatively rough surface of the conductor foils, which are usually made of copper, covered, which has proven to be useful in fixing the components by means of an adhesive.
    In particular, by such, compared to the copper smooth layer of the so-called. "Bleeding" effect, ie the escape of the solvent from the adhesive and the consequent drying out of the adhesive is reduced.
    In the next step according to FIG. 2, by means of a laser, preferably a UV laser, alignment marks 3, so-called fidudals, are bored into the lower conductor foil 1 and also into the support layer 2. Such alignment marks allow the registration of the circuit board with respect to those tools that are later required for further production or processing of the circuit board, and apply, for example by means of screen printing adhesive, make the assembly with components or to produce holes by laser. Generally, at least four such alignment marks are needed, but their exact number and configuration can or must be chosen individually.
    Now, as illustrated in FIG. 3, for example by roll coating or a printing method, in particular a screen printing method, adhesive layers 4 for fixing components are applied to the lower conductor foil 1, as for example in WO 2007/087660 A1 and WO 2009/143550 A1 Applicant described. After applying the adhesive layers 4, a vacuum treatment for venting the adhesive used can still be made.
    Thereafter, see Fig. 4, a component 5, for example a so-called "thinned", i. for example, a thickness of 50 to 200 pm ground chip, in the region of the adhesive layer 4 by a aligned with the alignment marks 3 pick and place machine with its back on the lower conductor foil 1 arranged. Here, alignment takes place on the outer edges and conductive pads 6 of the component 5. In general, of course, several components 5 are simultaneously applied to the metallic conductor layer 1. The adhesive of the adhesive layer or adhesive layers 4 can now be cured in a known manner, in particular thermally. An arrow P in Fig. 4 is intended to indicate the application of a certain contact pressure.
    The thermal curing or venting of the adhesive also eliminates the above-described problem of air or moisture inclusions in the adhesive.
    As components except chips, which contain highly integrated circuits, other components used in electronics come into question, such as resistors, capacitors, etc.
    After the application of the component 5, the actual embedding is carried out by applying a cut-out film 7 and a cover sheet 8, wherein reference is now made to FIG. 5 genome P12634 »· ·» · »·» ·· · »· · · · · · · ························································· will be. As a cut-out film 7, in this example, an FR4 film (an epoxy resin-impregnated glass fiber mat) is applied in a thickness which exceeds the height of the component including the thickness of the adhesive layer 4, so that a pressure relief of the component 5 during subsequent Verpressvorgänge is ensured. For homogeneous filling of the cavities between the assembled component 5 and the cut-out film 7, the non-cut cover sheet 8 is now placed over the existing structure. On the cover sheet 8 is followed by an upper conductor foil 9, in particular a Cu foil, together with an upper support layer 10 arranged thereon, which likewise can be formed as a Cu foil. The upper conductor foil 9, like the lower conductor foil 1, can have an insulating coating on its side facing the component 5. The layers or films 1, 2 and 9, 10 are mirror images of one another. The structure is now pressed using mechanical pressing pressure, temperature and negative pressure (vacuum), which is again indicated by an arrow P,
    Fig. 6 shows the result of the said pressing, it being noted that now also the alignment marks 3 is no longer "visible". are. The films 7 and 8 now form a virtually one-piece insulating layer 11, which also fills the alignment marks 3.
    In a next step, the lower and upper support layers 2 and 10 are removed, preferably by simply peeling, resulting in the construction shown in FIG.
    In a further step, see FIG. 8, the alignment marks 3 present in the lower conductor foil 1 can now be exposed so that they are "visible" from above. become. For this purpose, a removal of the upper conductor foil 9 and the underlying insulating layer 11 (FR4 foils) takes place in the region of the alignment marks 3 up to the lower conductor foil 1, which, however, must be preserved so that exemptions 12 occur. The problem here is the small thickness of this conductor foil 1, in the example a 2 pm Cu foil, and it has been shown in experiments that for carrying out this process, an ultra-short pulse laser, in particular a picosecond laser, the means of choice. In fact, less pulse length removes less material with one pulse, allowing for very good depth control.
    When using a one-picosecond laser, thermal effects can also be reduced to such an extent that no carbonization of the FR4 material takes place.
    Thanks to the short pulse length, with such a commercially available laser, it is possible to stop the removal of the material actually or directly above the thin conductor foil 1, so that the alignment marks 3 are preserved. This depth control can be further enhanced by the above-mentioned application of insulating coatings having different ablation properties compared to the overlying material. As can be seen in Figure 8, the clearances 12 created are significantly more extensive, i. generally of larger diameter than the alignment marks 3, so that no P12634 • Φ ·· • · ···· 4 • t • • • # • «· ♦ · • • · ··· • •» • * * ♦ · • Too high demands are placed on the orientation of the picosecond laser used.
    Once the alignment marks 3 are exposed, they can be used to precisely align the equipment for the following operations, symbolized in Fig. 9a by arrows A which represent the "viewing direction". represent the alignment optics. It should be noted that it may also be sufficient to use the alignment marks "optically". to indemnify, i. only remove material with the picosecond laser so far that a thin, a few microns thick layer of FR4 material remains above the alignment marks 3, which is optically transparent, so that the marks can be detected by the cameras used through this layer. The term "exposing the alignment marks" is thus to be understood in the sense that this exposure is at least as far as possible, that it allows an optical detection of these marks.
    After the precise alignment, holes 13 can be made by means of e.g. of a CCh laser (arrows L) are made. Since these holes 13 are produced with very accurate alignment, even small pads 6 can be contacted with certainty, so that many connections 6 on very small components 5 are possible.
    In practice, it has proven to be beneficial to use a combined process in the manufacture of the bores 13, in which first with a UV laser, the layer 9, which is usually made of copper, removed with a defined diameter, i. the hole "opened " and then using a CCb laser, the FR4 material of the layer 11 to the pads 6 of the components 5 are removed.
    An alternative possibility for producing the holes 13 is to produce these holes in a single step with the help of that picosecond laser, which was previously used for the exposure of the alignment marks 3. In this way, the use of different laser systems in carrying out the method according to the invention is unnecessary.
    According to Fig. 10, the production of contacts 14 in the holes 13 by double-sided electroplating of copper and the structuring of the upper and lower copper layers, e.g. by a photolithographic process for the production of printed conductors 15. Of course, through-connections between upper and lower printed conductors could also be produced.
    As an alternative to freeing the alignment marks 3 for their optical detection, it is also possible to carry out the alignment by means of X-rays, which is illustrated by arrows X in FIG. 9b. An appropriate source of radiation must then be used on one side of the circuit board assembly with corresponding imaging systems on the opposite side. In order to obtain a sufficiently high contrast in this case, however, the lower conductor layer 1, if it consists of copper, should be thicker than 5 pm. ♦ ·························································································································································································································· t ............. P12634
    List of reference signs (not part of the application) lower conductor foil lower support layer alignment marks adhesive layer component
    pads
    foil
    Cover foil upper conductor foil upper support layer
    insulating
    exemptions
    drilling
    contacts
    conductor tracks
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    权利要求:
    Claims (14)
    [1]
    P12634 ············································································································································································· Claims 1. Method of embedding at least one component, which is adhesively attached to a lower conductor foil and faces of which point upwards, into a printed circuit board, characterized by the following steps: a) providing a lower conductor foil (1), which is applied to a first metallic support layer (2) b) forming alignment marks (3) at least in the conductor foil (1), c) applying at least one adhesive layer (4) registered on the alignment marks (3) for fixing at least one component, d) seating registered on the alignment marks (3) a component (5) with its rear side on the adhesive layer (4), wherein the connection surfaces (6) of the component point upwards, and curing the adhesive of the at least one adhesive layer, e) embedding the component (5) in an insulating layer (11) , f) Apply g) pressing and solidifying the entire structure, h) removing the support layers (2, 10), i) exposing the alignment marks (3) of the lower conductor foil (1) by removing the insulating layer (11) in the region of the alignment marks and generating corresponding reliefs (12), j) registering holes (13) registered to the alignment marks by means of laser to the contact surfaces (6) of the component (5) and k) applying a conductor layer at least at the top of the structure, producing contacts (14) in the bores (13) to the connection surfaces (6) of the component (5) and structuring the conductor layer for the production of conductor tracks (15).
    [2]
    2. The method according to claim 1, characterized in that the lower and / or upper conductor foil (1,9) is provided with an insulating coating.
    [3]
    3. The method according to claim 1 or 2, characterized in that the conductor foils (1, 9) and the support layers (2,10) consist of copper. P12634 »I · · I * ftf» | * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * ......
    [4]
    4. The method according to claim 1, characterized in that in step b) the alignment marks (3) are formed by laser drilling.
    [5]
    5. The method according to claim 4, characterized in that in step b) the laser drilling is carried out with the aid of a UV laser.
    [6]
    6. The method according to claim 1, characterized in that in step c) the adhesive layer (4) is applied by screen printing.
    [7]
    7. The method according to claim 1, characterized in that in step d) alignment on outer edges and / or connection surfaces (6) of the component (5).
    [8]
    8. The method according to claim 1, characterized in that the component (5) is formed as a thinned chip.
    [9]
    9. The method according to claim 1, characterized in that the insulating layer (Π) consists of a the at least one component (5) corresponding cut-out film (7) and arranged above a continuous cover sheet (8).
    [10]
    10. The method according to claim 1, characterized in that in step g) mechanical pressing pressure, elevated temperature and negative pressure (vacuum) are applied to the structure.
    [11]
    11. The method according to claim 1, characterized in that in step i) the exemptions (12) are produced by means of a picosecond laser drilling technique.
    [12]
    12. The method according to claim 1, characterized in that in the production of the holes (13) in step j) in a first substep, first with a UV laser, the upper conductor foil (9) is removed and then in a second sub-step by means of a COr Lasers the layer (11) to the pads (6) of the components (5) is removed.
    [13]
    13. The method according to claim 1, characterized in that in step j) the bores (13) are produced in a single step using a Pi kosekunden laser drilling technique.
    [14]
    14. A printed circuit board with at least one embedded component (5) which is adhesively attached to a lower conductor foil (1) and the connecting surfaces (6) facing upward, produced by a method according to any one of the preceding claims.
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    同族专利:
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE19642488A1|1996-10-15|1998-04-16|Bernd Klose|Thin-layer circuit board for e.g. chip card|
    WO1998020530A1|1996-11-08|1998-05-14|W.L. Gore & Associates, Inc.|Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques|
    DE20021698U1|1999-11-16|2001-04-12|Fraunhofer Ges Forschung|Integration of a chip within a circuit board and integrated circuit|
    FR2822338A1|2001-03-14|2002-09-20|Sagem|Improved microelectronic component electrical contact pad connection having microelectronic component directly attached printed circuit face with thin isolated attachment and through|
    WO2007087660A1|2006-02-02|2007-08-09|At & S Austria Technologie & Systemtechnik Aktiengesellschaft|Printed circuit board element having at least one component embedded therein and method for embedding at least one component in a printed circuit board element|
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    WO2009143550A1|2008-05-30|2009-12-03|At & S Austria Technologie & Systemtechnik Aktiengesellschaft|Method for integrating at least one electronic component into a printed circuit board, and printed circuit board|
    WO2012016258A2|2010-08-04|2012-02-09|At & S Austria Technologie & Systemtechnik Aktiengesellschaft|Adhesive for fixing and/or embedding an electronic component and metnod and use|
    WO2012065202A1|2010-11-19|2012-05-24|At & S Austria Technologie & Systemtechnik Aktiengesellschaft|Method for mounting a component in or on a circuit board, and circuit board|
    FI20041680A|2004-04-27|2005-10-28|Imbera Electronics Oy|Electronics module and method for its manufacture|
    FI117812B|2004-08-05|2007-02-28|Imbera Electronics Oy|Manufacture of a layer containing a component|
    JP4800606B2|2004-11-19|2011-10-26|Ｏｋｉセミコンダクタ株式会社|Method for manufacturing element-embedded substrate|
    US7935893B2|2008-02-14|2011-05-03|Ibiden Co., Ltd.|Method of manufacturing printed wiring board with built-in electronic component|
    JPWO2009147936A1|2008-06-02|2011-10-27|イビデン株式会社|Manufacturing method of multilayer printed wiring board|
    US8914974B2|2008-10-30|2014-12-23|At & S Austria Technologie & Systemtechnik Aktiengesellschaft|Method for integrating an electronic component into a printed circuit board|
    AT12316U1|2008-10-30|2012-03-15|Austria Tech & System Tech|Method for integrating an electronic component into a printed circuit board|US10219384B2|2013-11-27|2019-02-26|At&S Austria Technologie & Systemtechnik Aktiengesellschaft|Circuit board structure|
    AT515101B1|2013-12-12|2015-06-15|Austria Tech & System Tech|Method for embedding a component in a printed circuit board|
    AT515447B1|2014-02-27|2019-10-15|At & S Austria Tech & Systemtechnik Ag|Method for contacting a component embedded in a printed circuit board and printed circuit board|
    AT14563U1|2014-03-31|2016-01-15|At&S Austria Technologie & Systemtechnik Ag|Method for producing a printed circuit board with at least one optoelectronic component|
    GB2524791B|2014-04-02|2018-10-03|At & S Austria Tech & Systemtechnik Ag|Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate|
    US10743422B2|2016-09-27|2020-08-11|At&S Austria Technologie & Systemtechnik Aktiengesellschaft|Embedding a component in a core on conductive foil|
    US10529593B2|2018-04-27|2020-01-07|Taiwan Semiconductor Manufacturing Co., Ltd.|Semiconductor package comprising molding compound having extended portion and manufacturing method of semiconductor package|
    US10912195B2|2019-01-02|2021-02-02|The Boeing Company|Multi-embedded radio frequency board and mobile device including the same|
    CN110996495B|2019-12-20|2021-07-23|广州兴森快捷电路科技有限公司|Embedded PCB and manufacturing method thereof|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA740/2012A|AT513047B1|2012-07-02|2012-07-02|Method for embedding at least one component in a printed circuit board|ATA740/2012A| AT513047B1|2012-07-02|2012-07-02|Method for embedding at least one component in a printed circuit board|
    PCT/AT2013/050128| WO2014005167A1|2012-07-02|2013-06-25|Method for embedding at least one component into a printed circuit board|
    EP13753805.4A| EP2868170B1|2012-07-02|2013-06-25|Method for embedding at least one component into a printed circuit board|
    US14/412,594| US20150189763A1|2012-07-02|2013-06-25|Method for Embedding at Least One Component in a Printed Circuit Board|
    CN201380035098.8A| CN104509222B|2012-07-02|2013-06-25|Method at least one component to be embedded in printed circuit board|
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